PCB Current Distribution Simulation and Design System

Software copyright description: Based on the Finite Element Method (FEM), the system performs coupled analysis of current density, Joule heating, and voltage drop for planes, vias, and traces. It integrates nonlinear material resistivity and temperature rise models, supporting DC, transient high-current, and skin effect scenarios. It can automatically identify high-density bottleneck areas and optimize copper thickness, window openings, and thermal current-sharing paths. The system is widely used in power modules, automotive high-voltage applications, and heavy copper board designs, ensuring current-carrying safety and thermal reliability.